Product Details
8100-1003-114
Motorola Part Number R1478A
**To purchase please call: 305-451-4722, fax: 305-451-3374, or email: sales@ape.com ITEM NOT AVAILABLE ONLINE**The Chipmaster SMD-1000 system is a reliable SMT Component PCB rework and repair system, suitable for small to
medium PCB assemblies, BGA and SMT components, requiring Profile Temperature Control.
Wide Ranging
The Chipmaster SMD-1000 PCB repair
system covers a wide range of SMT
components providing a controlled
PCB rework environment, which cares
for your repair process. The system
features a simple operation with
automatic ?Timed? process control
and selected thermal BGA profiling.
Energy Rework Reflow
What makes the Chipmaster different
from other Hot Air SMT rework
machines is ?CONVECTION POWER.?
Its high-power heater reworks sensitive
components at original Convection
Oven temperatures.
Lead Free Rework
Oven Temperature Convection Rework
is critical when reworking Lead Free
components. The SMT component
reflow temperature is higher for Lead-
Free materials but the heat source
should be kept to an optimum convection
temperature to avoid damaging
surrounding SMT components.
Replicating the manufacturing method
using a convection hot air reflow technology
is the safest method
The Chipmaster requires an APE Bottom
Heater featured on page 10 for
Lead Free rework and repair.
Solder Integrity
The following micro sections indicate
the superior quality of a solder
junction when operating at Low
Temperature using the Chipmaster.
Chipmaster Rework Temperature
At the original Convection Oven Temperature
integrity of solder remains intact.
Common Low Power Rework Temperatures
With air temperatures greater than the original
Convection Oven Temperature the integrity of
solder begins to break down.
