Sniper III 220V 50 Hz
** CALL FOR PRICING**The SNIPER III Split Vision Rework System is a reliable SMT Component PCB rework and repair system, suitable for small to
medium PCB assemblies, BGA and SMT components, requiring Profile Temperature Control.
The SNIPER III Split Vision Rework System covers a wide range of SMT
components providing a controlled
PCB rework environment, which cares
for your repair process. The system
features a simple operation with
automatic ?Timed? process control
and selected thermal BGA profiling.
Energy Rework Reflow
What makes the SNIPER III different
from other Hot Air SMT rework
machines is ?CONVECTION POWER.?
Its high-power heater reworks sensitive
components at original Convection
Lead Free Rework
Oven Temperature Convection Rework
is critical when reworking Lead Free
components. The SMT component
reflow temperature is higher for Lead-
Free materials but the heat source
should be kept to an optimum convection
temperature to avoid damaging
surrounding SMT components.
Replicating the manufacturing method
using a convection hot air reflow technology
is the safest method
The SNIPER III features a 600W APE Bottom
Heater for Lead Free High Mass rework and repair. (1200W Available Upon Request)
The following micro sections indicate
the superior quality of a solder
junction when operating at Low
Temperature using the SNIPER III.
SNIPER III Rework Temperature
At the original Convection Oven Temperature
integrity of solder remains intact.
Common Low Power Rework Temperatures
With air temperatures greater than the original
Convection Oven Temperature the integrity of
solder begins to break down.